LTCC and glob-top packaging for 24 GHz MMICs with integrated antennas

Erik Öjefors
Uppsala University, Dep. of Engineering Sciences, Sweden

Anders Rydberg
Uppsala University, Dep. of Engineering Sciences, Sweden

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Ingår i: GigaHertz 2003. Proceedings from the Seventh Symposium

Linköping Electronic Conference Proceedings 8:22, s.

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Publicerad: 2003-11-06


ISSN: 1650-3686 (tryckt), 1650-3740 (online)


A packaging method for low cost 24 GHz MMIC:s with on chip antenna using LTCC carrier substrates and glob-top encapsulation is evaluated. Microstrip ring resonators are used for characterization of single and double layers of Ferro A6-S LTCC material at 24 GHz. Quality factors close to 100 are obtained; and good agreement with the manufacturers data is demonstrated. Five different commercial glob-top; side-fill and cavity fill materials are used to cover the LTCC ring resonators. Measurements show only minor degradation in resonator quality factor when glob-tops are applied; thus indicating low dielectric losses in the encapsulation material.


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