Konferensartikel

LTCC and glob-top packaging for 24 GHz MMICs with integrated antennas

Erik Öjefors
Uppsala University, Dep. of Engineering Sciences, Sweden

Anders Rydberg
Uppsala University, Dep. of Engineering Sciences, Sweden

Ladda ner artikelhttp://www.ep.liu.se/ecp_article/index.en.aspx?issue=008;article=022

Ingår i: GigaHertz 2003. Proceedings from the Seventh Symposium

Linköping Electronic Conference Proceedings 8:22, s.

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Publicerad: 2003-11-06

ISBN:

ISSN: 1650-3686 (tryckt), 1650-3740 (online)

Abstract

A packaging method for low cost 24 GHz MMIC:s with on chip antenna using LTCC carrier substrates and glob-top encapsulation is evaluated. Microstrip ring resonators are used for characterization of single and double layers of Ferro A6-S LTCC material at 24 GHz. Quality factors close to 100 are obtained; and good agreement with the manufacturers data is demonstrated. Five different commercial glob-top; side-fill and cavity fill materials are used to cover the LTCC ring resonators. Measurements show only minor degradation in resonator quality factor when glob-tops are applied; thus indicating low dielectric losses in the encapsulation material.

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Referenser

[1] E. Öjefors; F. Bouchriha; K. Grenier and A. Rydberg; ”24 GHz ISM-band Antennas on Surface Micromachined Substrates for integration with a Commercial SiGe Process;” accepted for European Conference on Wireless Technology (ECWT); Munich; Germany; Oct. 2003.

[2] L. Li; B. Cook; and M. Veatch; “Measurement of RF properties of glob top and under-encapsulant materials;” in Proc. Electrical Performance of Electronic Packaging; Cambridge; MA; vol. I; pp. 121-124; Oct. 2001

[3] R. Sturdivant; C. Quan; and J. Wooldridge; “Investigation of MMIC Flip Chips with Sealants for Improved Reliability without Hermeticity;” in Proc. MTT-S Int. Microwave Symp.; San Francisco; CA; pp. 239-242; Jun. 1996

[4] R. Kulke; W. Simon; A. Lauer; M. Rittweger; P. Waldow; S. Stringfellow; R. Powell; M. Harrison; J-P. Bertinet; “Investigation of Ring Resonators on Multilayer LTCC;” MTT-S Int. Microwave Symp; Workshop on Ceramic Interconnect Technologies; Phoenix; AZ; May 2001

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