Fabrication and modeling of passive components for InP-based MMICs

Anders Mellberg
Chalmers University of Technology, Sweden

Emmanuil Choumas
Unaxis Balzers Aktiengesellschaft, Liechtenstein

Niklas Rorsman
Chalmers University of Technology, Sweden

Samuel P. Nicols
Chalmers University of Technology, Sweden

Jan Grahn
Chalmers University of Technology, Sweden

Herbert Zirath
Chalmers University of Technology, Sweden

Ladda ner artikel

Ingår i: GigaHertz 2003. Proceedings from the Seventh Symposium

Linköping Electronic Conference Proceedings 8:61, s.

Visa mer +

Publicerad: 2003-11-06


ISSN: 1650-3686 (tryckt), 1650-3740 (online)


Passive components for use in planar Monolithic Microwave Integrated Circuits (MMICs) based on High Electron Mobility Transistors (HEMTs) on indium phosphide substrates are presented. Design; fabrication; and modeling issues of capacitors; resistors; inductors; transmission lines; via holes; and air bridges have been addressed. Sputtered thin films have been utilized to make metal-insulator-metal (MIM) capacitors and thin film resistors (TFRs). Silicon dioxide and silicon nitride MIM capacitors exhibited capacitances from 100 to 300 pF/mm2 and tantalum nitride TFRs sheet resistivities of 80-85 ohms per square. Our microstrip transmission line fabrication technology has been utilized to make multi-turn; air bridged spiral inductors spanning from 0.5 nH to 4 nH. Air bridges and ground via holes have been used for connection and testing purposes. Scattering (S-) parameters; from 5 to 48 GHz; of all fabricated components have been measured and scalable models for CAD purposes investigated.


Inga nyckelord är tillgängliga


[1] J. Scarpulla; E. D. Ahlers; D. C. Eng; D. L. Leung; S. R. Olson; and C.-S. Wu; "Dielectric breakdown; defects and reliability in SiN MIMCAPs;" GaAs Reliability Workshop; pp. 92- 105; 1998.

[2] G. Bartolucci; F. Giannini; E. Limiti; and S. P. Marsh; "MIM capacitor modeling: a planar approach;" IEEE Transactions on Microwave Theory and Techniques; vol. 43; pp. 901-903; 1995.

[3] M. Engels and R. H. Jansen; "Rigorous 3D EM simulation and an efficient approximate model of MMIC overlay capacitors with multiple feedpoints;" IEEE MTT-S International Microwave Symposium Digest; pp. 757-760 vol.2; 1993.

[4] W. S. Lam; A.K. Nakano; K. Ip; K. Yang; C. Liu; L. Yen; H.C.; "Experimental modeling for millimeter-wave monolithic integratedcircuit components;" IEEE MTT-S International; vol. 1; pp. 477-480; 1988.

[5] J. P. Mondal; "An experimental verification of a simple distributed model of MIM capacitors for MMIC applications;" IEEE Transactions on Microwave Theory and Techniques; vol. MTT-35; pp. 403-408; 1987.

[6] E. Pettenpaul; H. Kapusta; A. Weisgerber; H. Mampe; J. Luginsland; and I. Wolff; "CAD models of lumped elements on GaAs up to 18 GHz;" IEEE Transactions on Microwave Theory and Techniques; vol. 36; pp. 294-304; 1988.

[7] L. Gmelin; "Gmelins Handbuch der anorganischen Chemie System-Nr 49 Niob T.B. L. 1;" 8.; vollig neu bearb. Aufl. / begonnen im Auftrage der Deutschen chemischen Gesellschaft von R. J. Meyer ... ed: Springer-Vlg;; 1970; pp. 49.

[8] R. Williams; Modern GaAs processing methods; 2nd. ed. Norwood; MA: Artech House; Inc.; 1990.

[9] R. F. Kopf; R. Melendes; D. C. Jacobson; A. Tate; M. A. Melendes; R. R. Reyes; R. A. Hamm; Y. Yang; J. Franckoviak; N. G. Weimann; H. L. Maynard; and C. T. Liu; "Thin-film resistor fabrication for InP technology applications;" Journal of Vacuum Science Technology B; vol. 20; pp. 871-5; 2002.

[10] E. J. Hammerstad; O.; "Accurate models for microstrip computer-aided design;" MTT Symposium; pp. 407-409; 1980.

[11] C. L. Hoer; C.; "Exact inductance equations for rectangular conductors with applications to more complicated geometrics;" Journal of Research of NBS; vol. 69C; pp. 127-137; 1965.

[12] N. Marcuvitz; "Waveguide Handbook;" in Waveguide Handbook. New York: McGraw-Hill; 1951; pp. sections 5.11 and 5.28.

[13] U. S. Ghoshal and L. N. Smith; "Skin effects in narrow copper microstrip in 77 K;" IEEE Transactions on Microwave Theory and Techniques; vol. 36; pp. 1788-1795; 1988.

[14] K. Gupta; R. Garg; and I. Bahl; Microstrip lines and slotlines. Dedham; MA: Artech House; 1979.

[15] H. Wheeler; "Formulas for the Skin Effect;" Proc. IRE; vol. 30; pp. 412-424; 1941.

[16] M. E. Goldfarb and R. A. Pucel; "Modeling via hole grounds in microstrip;" IEEE Microwave and Guided Wave Letters; vol. 1; pp. 135-137; 1991.

[17] M. E. Goldfarb and V. K. Tripathi; "The effect of air bridge height on the propagation characteristics of microstrip;" IEEE Microwave and Guided Wave Letters; vol. 1; pp. 273-274; 1991.

Citeringar i Crossref